It is mainly used to eliminate the bubbles produced in the bonding process of TN, STN, TFT liquid crystal glass substrate and polarizer, and also used to eliminate the bubbles in the bonding process of touch screen glass to glass and glass to OCA conductive film.
Parameter |
Power | 220VAC +/-10%, 50 ～ 60 Hz, 10kVA |
Operating environment | 23ºC +/-5ºC, 40% ～ 100% humidity |
Pressure | 5 ～ 7kgf/cm² |
Gas consumption rate | 50L/M |
、Can body specification | 250mm × 330mm |
、Overall dimension of equipment | 400mm × 410mm × 430mm |
、Weight | 28kg |
performance |
working pressure | 0.45 ～ 0.6 Mpa |
temperature range | 30℃ ～ 50℃ |
operation mode | Semi automatic defoaming |
Work cycle | 10 ～ 20min |
Size | 13 inch |
Protection system | Mechanical and electric double interlock |
Pressure system | Equipped with pressure controller, regulator and screw valve |
The working cabin of the equipment is made of carbon steel.